www.sslchina.org www.ifws.org.cn
Call for Papers
November. 23-25, 2020
Shenzhen Convention & Exhibition Center Ÿ Guangdong Ÿ China
The 16th China International Forum on Solid State Lighting & 2019 International Forum on Wide Bandgap Semiconductors (SSLCHINA & IFWS 2019) will be held on November 25-27, 2019 at Shenzhen Convention & Exhibition Center. SSLCHINA & IFWS 2019 is a premier forum for technical and industrial discussions in all areas of power semiconductor and solid-state lighting. It aims to promote collaborative innovation of the whole industry chain including materials growth, equipment, devices and applications in the related areas.
Full length manuscripts of accepted papers will be published in IEEE Xplore, and Indexed by EI.
Hosts：
China Solid State Lighting Alliance (CSA)
China Advanced Semiconductor Industry Innovation Alliance (CASA)
CONTENTS：
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P201: The Technology in Substrate, Epitaxy and Wafer Growth Equipment (SiC & GaN)
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- The influence of Materials on Epitaxy (MO source, other PVD source and epitaxial mechanism) - The Growth and Manufacture of Wafer - Homo/Heteroepitaxy - Defects and Characterization - The Progress of Equipment in Research, Manufacture and Detection
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P202: Technologies for Power Electronics and Packaging (SiC & GaN)
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- SiC/GaN based power system - SiC/GaN Power electronics devices gate driver design - SiC/GaN Power electronics devices packaging technology - SiC/GaN Power electronics devices application - SiC/GaN Power electronics devices reliability - SiC/GaN Power electronics devices market research
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P203: RF Technology and 5G Mobile Communication
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- High Efficiency GaN Microwave Device Technology - GaN Epitaxial Technology for High Efficiency Microwave Device - GaN Monolithic Microwave IC Design - Process and Device Reliability of GaN Microwave Devices - Large Signal Equivalent Circuit Modeling and Physical Modeling of GaN Microwave Devices - Application of GaN devices and circuits in mobile communication - Application of GaN HEMT Device in 5G Mobile Communication
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P204: Solid-State Ultraviolet Device Technology
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- AIN and Other Novel Substrate Materials for UV Optoelectronic Devices - Design and Epitaxial Growth of Nitride Semiconductor UV Light Emitting and Detecting Materials - P - Type Doping of AlGaN epitaxial films with High Al Composition - High Efficiency Solid State Ultraviolet Light Emitting Devices - High Sensitivity Ultraviolet Detection and Imaging Devices - Light Extraction, Thermal Management and Reliability of Packaging and Modules of UV Light Source - New Progress of Ultraviolet UV Semiconductor Materials and Devices
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P205: LED Chip, Packaging, Modules and Reliability |
- New Progress of LED Chip Manufacturing Technologies - High Efficient UV, Blue, Green and Red Chip Technology - Mounted Chips, Flip Chip and Vertical Chip Technology - Latest Development of LED Packaging Materials (Substrate, Solid Crystal Materials, Silica Gel, Fluorescent Powder, etc.) - Fluorescent Powder, Quantum Dot Technology and Coating Technology - Lens Design and Optic Module - Chip level and Wafer Level Packaging Technology - Multi-chip Packaging, Design and Optimization of COB - New Development of Light Source with High Quality and Full Spectrum - Advanced Packaging Technology and Manufacturing Technology with High Sigma and Low Color Tolerance - The New Generation of LED Light Source and Light Engine
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P206: LED Lighting in Bio-Agriculture
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- Advances in Biological (Animal and Plant) Responses to Light Qualities - Bio-Agricultural Light Recipes Technology - Manufacturing Technology and New Technology of Bio-Agricultural LED Lamps - Advances in LED Modern Agriculture (Plant Factory, Seedling Nursery, Supplementary Lighting in Greenhouses, intensive livestock & poultry culture, Aquaculture, Marine Fishing, Propagation of Edible Fungi and Microalgae Plant Protection by Trapping Insets) - Energy Saving Design in LED for Bio-Agriculture - New Materials and New Technologies of LED for Agriculture - Design and Optimization of Low Cost LED for Agriculture
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P207: Light Quality and Lighting for Health |
- Photobiological investigation of light radiation damage and health conditioning, - Mechanism for the Effects of Light on Visual Health, - New LED Light Source for Health and Medical Applications, - Quality evaluation and Application of Light Environment, - Standardization for Healthy Lighting and Clinical Trials on LED Phototherapy, - LED Applications in Healthy Lighting and Optical Medicine, - Light Environmental Design to consider Healthy and Lighting Quality, - Control Technologies for LED Healthy and Colour Quality Lighting, - Development and evaluation of Color Quality Metrics including Color Fidelity, Color Gamut, luminance, CCT, and - Color Quality metrics for different applications.
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P208: Micro-LED and other Novel Display
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- Micro-LED Material, Devices, Drive, Characterization and Application Technologies - OLED Material, Devices, Drive, Characterization and Application Technologies - Technologies for Laser Display and Lighting - QLED Material, Devices, Drive, Characterization and Application Technologies - PerLED and Other Novel Light Emitting Devices - Advanced Thin Film Technology for Display - Flexible Backplane and Packaging Technology - Transparent Conductive Materials - Circuit Drive and Control Technologies for Novel Display - Highly Integrated Semiconductor Information Displays ( HISID ) Technologies
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P209: Ultra-Wide Bandgap Semiconductor and other Advanced Semiconductor
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- Key equipment technology for fabrication of the ultra-wide bandgap semiconductors - Fabrication and material study of the ultra-wide bandgap semiconductors - Power electronics technology of the ultra-wide bandgap semiconductors - Optoelectronic device technology of the ultra-wide bandgap semiconductors - Research and application of other new semiconductor materials
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P210: Technologies for Reliability and Thermal Management
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- Novel Materials for Heat Dissipation - Thermal Management Technologies - Reliability Oriented Design - Fault Diagnosis and Prediction - Failure Detection and Failure Analysis - Accelerated Life Testing and Prediction Methods - Failure Mode and Simulation - Control and Reliability Screening in Manufacturing Process
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P301: Technology for Driver, Intelligent Control and Smart Lighting / Visible Light Communication and 5G Connection Summit
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- Defects in nitride semiconductors - Reliability of new packing materials - Thermal issue & thermal management - Product reliability estimation - Process reliability issue - New failure mechanism/ failure analysis - Design for reliability/analysis & modelling - Reliability challenges beyond illumination |
Technical Program Committee
Chair：
ZHANG Rong (Xiamen University)
Co Chairs：
LIU Ming (Institute of Microelectronics, CAS),
JIANG Fengyi (Nanchang University),
LI Jinmin (Institute of Semiconductors, CAS),
ZHANG Guoyi (Peking University),
SHEN Bo (Peking University),
QIU Yufeng (State Grid),
SHENG Kuang (Zhejiang University),
ZHANG Bo (University of Electronic Science and Technology of China),
XU Ke (Suzhou Institute of Nano-tech and Nano-bionics, CAS),
Kevin J. CHEN (Hong Kong University of Science and Technology),
Wai Tung NG (University of Toronto),
ZHANG Guoqi (Delft University of Technology)
Session Chairs: SHEN Bo (Peking University), XU Xiangang (Shandong University), SHENG Kuang (Zhejiang University), ZHANG Bo (University of Electronic Science and Technology of China), G.Q. LU (Virginia Tech), Wai Tung NG (University of Toronto), CAI Shujun (13th Research Institute of CETC), ZHANG Naiqian (Dynax Semiconductor), WANG Junxi (Institute of Semiconductors, CAS); KANG Junyong (Xiamen University), JIANG Fengyi (Nanchang University), Jay. Guoxu LIU (ShineOn), YANG Qichang (Institute of Environment and Sustainable Development in Aguriculture, CAAS), LIU Ying (Dalian Ocean University), Ronnier LUO (Zhejiang University), QU Jia (WMU Zhejiang Eye Hospital), YAN Qun (Fuzhou University), LIU Ming (Institute of Microelectronics, CAS), TAO Xutang (Shandong University), ZHAO Lixia (Institute of Semiconductors, CAS), LUO Xiaobing (Huazhong University of Science and Technology)
Session Members: XU Ke (Suzhou Institute of Nano-tech and Nano-bionics, CAS), LI Dabing (Changchun Institute of Optics, Fine Mechanics and Physics, CAS), BI Wengang (Hebei University of Technology), WANG Zhiyue (CETC), DU Zhiyou (Advanced Micro-Fabrication Equipment), WU Jun (NAURA Technology Group), YANG Min (Jiangsu Nata Opto-electronic Material), BAI Song (Nanjing Electronic Devices Institute), ZHANG Jincheng (Xidian University), LIANG Huinan (Xinguan Technology), WANG Laili (Xi’an Jiaotong University), LIU Yang (Sun Yat-sen University), CHEN Tangsheng (Nanjing Electronic Devices Institute), LIU Jianl (ZTE), AO Jinping (University of Tokushima), ZHANG Yun (Institute of semiconductors, CAS), TAO Guoqiao (Ampleon Netherlands B.V), LU Hai (Nanjing University), KUO Hao-Chung (National Chiao Tung University), CHEN Changqing (Huazhong University of Science and Technology), LI Xiaohang (King Abdullah University of Science & Technology), YUN Feng (Xi'an Jiaotong University), YI Xiaoyan (Institute of Semiconductors, CAS), MO Qingwei (Elec-Tech International), GUO Weiling (Beijing University of Technology), ZHANG Jianli (Nanchang University), PAN Jinming (Zhejiang University), HE Dongxian (China University of Agriculture), XU Hong (LumiGrow, Inc.), LIU Houcheng (South China Agricultural University), SONG Changbin (Institute of Semiconductors, CAS), LIN Yandan (Fudan University), XIONG Daxi (Suzhou Institute of Biomedical Engineering and Technology, CAS), MOU Tongsheng (Zhejiang University), CAI Jianqi (China National Institute of Standardization), YAN Chunhui (Shenzhen Institute of Wide Bandgap Semiconductors), XU Zheng (Beijing Jiaotong University), LIU Bin (Nanjing University), MA Songlin (TCL), LIU Zhaojun (Southern University of Science and Technology), LONG Shibing (Institute of Microelectronics, CAS), WANG Xinqiang (Peking University), LIU Yuhuai (Zhengzhou University), WANG Hongxing (Xi'an Jiaotong University), Shi-Wei. Ricky LEE (Hong Kong University of Science and Technology), LIU Sheng (Wuhan University), YANG Daoguo (Guilin University of Electronic Technology)
importANT DATES & METHOD OF SUBMISSION
1. Deadline for abstract submission: August 15th 2020;
2. Paper acceptance notification: August 25th, 2020;
3. Deadline for full paper submission: October 10th, 2020;
4. Full paper acceptance notification: October 25th, 2020;
5. Deadline for softcopy submission of presentations PPT and posters: November 20th, 2020..
REVIEW PROCEDURE
1. Authors must submit extended abstracts in advance.
2. Authors will be informed of paper acceptance with categories of Oral Presentation, Poster Presentation and Conference Proceedings.
3. Authors prepare final submissions depending on the following status:
1) Oral Presentations: Authors need to prepare paper and presentation files (PPT/PDF)
2) Poster Presentations: Authors need to prepare paper and poster files (The Technical Program Committee will audit the posters and inform the authors. Authors need to prepare posters according to the template and bring the hardcopy posters to the designated Poster Display area for wall mounting).
3) Conference Proceedings: Authors should prepare the papers. Authors have to prepare final papers according to the guidelines and given template.
Note:
1) The template can be downloaded from the paper contribution platform of the forum: http://www.sslchina.org/paper?lang=en or http://www.ifws.org.cn/paper?lang=en. Authors are required to prepare papers and other materials based on the provided template in time to pass the review successfully.
2) Full length manuscripts of accepted papers will be published in IEEE Xplore, and Indexed by EI.
PAPER REQUIREMENTS
1. Basic Requirements
1) The paper should not have been published in other technical publications or by other technical conferences.
2) Prominent theme, distinct content, accurate data, rigorous discussion, clear conclusion and adopted legal measurement unit.
2. Abstract Submission
Authors are required to submit extended abstracts according to the paper format template given on the conference website.
3. Paper Format
The paper should be written in APA Format according to the paper format template given on the conference website. The papers should adopt Word format. The total pages of the paper are limited to 4.
4. Language of Abstracts, Posters and Papers
1) Abstracts/posters/papers have to be in Standard English.
2) Both Chinese and English are acceptable for oral presentations, but only English can be used for the presentation files (PPT/PDF) and conference proceedings.
Note: No commercial promotions allowed for specific companies and products; otherwise, the papers will not be selected for oral presentations and conference proceedings.
For further questions about the paper submission, please contact us,
Lu BAI
Telephone: 010-82387600-602
Email: papersubmission@china-led.net
